+
  • 粘胶6011B.jpg

Adhesive 6011B

Encapsulation is the process of mechanically or manually pouring liquid polyurethane composites into devices containing electronic components and circuits, and curing them under room temperature or heating conditions to become high-performance thermosetting polymer insulation materials.

Classification:

Details

Encapsulation is the process of mechanically or manually pouring liquid polyurethane composites into devices containing electronic components and circuits, and curing them under room temperature or heating conditions to become high-performance thermosetting polymer insulation materials. The liquid polyurethane composite used in this process is the potting adhesive. Encapsulation is the process of mechanically or manually pouring liquid polyurethane composites into devices containing electronic components and circuits, and curing them under room temperature or heating conditions to become high-performance thermosetting polymer insulation materials. The liquid polyurethane composite used in this process is the potting adhesive.

 

Other Products

I want to consult

Submission